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Press Releases
Press Releases


02/05/2024
テレダイン・レクロイ、 CrossSyncTM PHYの機能を拡張し、PCI Express® 6.0に対応



02/01/2024
Teledyne LeCroy and Alphawave Semi Unveil PCIe®️ 7.0 Signal Generation and Measurement



01/30/2024
Teledyne LeCroy Extends CrossSync™️ PHY Technology to PCI Express® 6.0



01/24/2024
Introducing qdPrime™: Revolutionizing DisplayPort Testing with Enhanced Capabilities



01/24/2024
テレダイン・レクロイ 拡張機能でDisplayPortテストのテストリソース・時間・労力を大幅に削減するqdPrime™ソフトウェアを提供開始



11/14/2023
Teledyne LeCroy Announces Industry-First Compute Express Link™ (CXL) Device Validation Solution



10/12/2023
신제품 MIPI® C-PHY 및 D-PHY 아날라이저 및 제너레이터 출시로 고성능 디스플레이 및 이미징 센서 테스트 가속화



10/04/2023
New MIPI® C-PHY and D-PHY Analyzer and Generator Accelerates High-Performance Display and Imaging Sensor Testing



10/03/2023
Teledyne to Acquire Xena Networks



09/06/2023
텔레다인르크로이, 65GHz 12비트 오실로스코프 플랫폼 발표



09/06/2023
テレダイン・レクロイ、 65GHz 12ビット・オシロスコープ・プラットフォーム 「WaveMaster® 8000HD」を発表



09/05/2023
Teledyne LeCroy Announces 65 GHz 12-bit Oscilloscope Platform



08/01/2023
Teledyne LeCroy enables Validation Testing of Solid-State Storage Power and Sideband Capabilities



07/19/2023
VESA® Approves the use of New DisplayPort 2.1 Compliance Tests



07/18/2023
Industry First Flexible Data Placement Mode Test Solution for Solid-State Storage Devices



07/11/2023
FRVS™ Approved for All Required Bluetooth® BR/EDR, LE, and AoA/AoD Conformance Validation Tests



06/27/2023
Enterprise Level PCI Express 5.0 based Solid State Drive Validation Test Solutions are Now Available



06/27/2023
エンタープライズレベルのPCI Express 5.0ベースのソリッド ステート ドライブ検証テストソリューションが登場



06/21/2023
テレダイン・レクロイ、 USB Type-C®、HDMI®2.1、その他高速ケーブル対応の 高機能ケーブルテスター「RapidWave4000」を発表



06/13/2023
Teledyne LeCroy Develops the RapidWave4000 Advanced Cable Tester for High-speed USB Type-C®, HDMI® 2.1 and Other Cables



06/08/2023
Industry First PCI Express® 6.0 Protocol Analyzer Enables Development of Next Generation High Performance PCIe Devices



06/08/2023
業界初のPCI Express® 6.0プロトコルアナライザが次世代高性能PCIeデバイスの開発を実現



05/16/2023
First PCI Express® 6.0 Interposer for OCP NIC 3.0 Devices



04/27/2023
First CXL 1.1 Compliance Test Solution Approved by Compute Express Link Consortium



04/04/2023
New HDMI® 2.1a Source or Sink Protocol Test Solutions



04/04/2023
First PCI Express® 6.0 and CXL EDSFF Interposers



03/14/2023
High-performance Frontline X240 Wireless Analyzer Now Supports Full Bluetooth Dual-Mode Capture



02/14/2023
Industry First PCI Express® 6.0 and CXL Interposer Improves Data Captures for Speeds up to 64 GT/s



02/07/2023
Teledyne LeCroy Announces Availability of Open Compute Project® (OCP) v2.0 SSD Validation Testing



02/02/2023
テレダイン・レクロイのリアルタイムオシロスコープLabMasterが、 情報通信研究機構により世界で初めて実現された、 標準外径の55モード光ファイバで毎秒1.53ペタビットの 大容量伝送実験に採用



01/24/2023
Teledyne LeCroy Extends CrossSync™ PHY Technology to USB4® and USB Type-C® Connectors



01/20/2023
テレダイン・レクロイのオシロスコープLabMaster 10 Zi-Aが Granite River Labs社のUSB4、DisplayPort 2.1、Thunderboltの テスト機器として採用決定



01/16/2023
Teledyne LeCroy Supports PCI Express® 6.0 Electrical Testing



01/10/2023
Industry’s First 800 Gigabit Ethernet, 8 Lane PAM4 Protocol Test Solution



01/10/2023
Granite River Labs Selects Teledyne LeCroy LabMaster 10 Zi-A Oscilloscope for USB4®, DisplayPort™ 2.1 and Thunderbolt™ Testing



01/01/2023
Teledyne LeCroy Develops the RapidWave4000 Advanced Cable Tester for High-speed USB Type-C®, HDMI® 2.1 and Other Cables



11/15/2022
Portable and Versatile HDMI 2.1 and DisplayPort 2.0 Analyzer/Generator Accelerates Interoperability Testing



11/15/2022
Teledyne LeCroy Releases SimPASS™ USB Allowing USB4 Gen4 Pre-Silicon Verification



11/15/2022
Solid State Drive Testing Made Easy with New PCI Express™ 5.0 Test System



11/01/2022
Teledyne LeCroy Now Offers Widest Range of 10 Mb/s IVN Solutions



10/27/2022
Teledyne LeCroy Adds Support for USB4® Version 2.0 Physical Layer Testing



10/18/2022
Teledyne LeCroy Releases Industry’s First DisplayPort 2.1 Video Analyzer and Generator



09/22/2022
Industry-First SSD Compliance Suite Software Enables Open Compute Project (OCP) Validation Testing



09/06/2022
Protocol Test system approved by USB-IF for USB Power Delivery, USB Type-C® and USB 3.2 Link Layer Compliance Testing



08/02/2022
First PCI Express® 5.0 Mini Cool Edge IO™ (MCIO) Interposer



07/28/2022
SmartTest™ Automation Improves Internet of Things (IoT) Device Testing



07/12/2022
OakGate PCIe® Gen5 Solid-State Storage Test Solutions Deliver Increased Scalability and Performance



06/14/2022
First PCIe® Integrity and Data Encryption (IDE) Protocol Testing Solutions Now Available



05/10/2022
First PCI Express® 5.0 OCP NIC 3.0 Interposer



05/04/2022
Teledyne LeCroy Simplifies USB System Integration Debug with Industry-first USB Type-C® Test Coupon Fixtures



04/14/2022
Teledyne LeCroy Speeds PCIe® Compliance testing, Provides additional Electrical and Protocol Test Equipment



04/12/2022
Teledyne LeCroy Develops the Most Accurate Measurement System for GaN and SiC Semiconductor Analysis



03/15/2022
PCI-SIG® Approves Teledyne LeCroy PCI Express® 5.0 Compliance Solution



03/09/2022
Industry First 100Gb/s PAM4 Ethernet Test Platform



02/15/2022
Bluetooth® SIG Approves Teledyne LeCroy’s FRVS™ RF Test System



02/08/2022
Teledyne LeCroy Voyager M4x Supports USB4® Compliance Testing Program



01/11/2022
MIPI M-PHY® High-Speed GEAR 5 UFS 4.0 Protocol Analyzer/Exerciser with Solder-in Probe is now Available



12/07/2021
First PCI Express® 5.0 EDSFF Interposers for SSD Protocol Testing



11/22/2021
Teledyne LeCroy Extends CrossSync™ PHY Technology to PCI Express® CEM Form Factor



09/28/2021
Industry’s First SuperSpeed USB 20Gb/s Exerciser Now Available



09/21/2021
First PCI Express® 5.0 M.2 Interposer for SSD Protocol Analysis



09/21/2021
Credo Selects Teledyne LeCroy’s SierraNet M648 for 400GbE Auto-Negotiation and Link Training Validation



08/03/2021
Data Center Analytics Software Dramatically Improves Workload Characterization and Issue Resolution Time



07/21/2021
Teledyne LeCroy adds Clarke-Park Transformation Software to Motor Drive Analyzers and High-definition Oscilloscopes (HDOs)



07/20/2021
Teledyne LeCroy Announces Fastest and Most Complete DisplayPort™ 2.0 PHY Test Solutions



07/07/2021
First Single-system Protocol Analyzer for Bluetooth® Technology and Wi-Fi 6E



06/15/2021
New PCI Express® 5.0 U.2/U.3 Interposer for SSD Protocol Analysis



06/02/2021
Industry’s First Test Platform for USB Power Delivery 3.1 Devices



05/20/2021
Summit Z58 Protocol Exerciser / Analyzer Approved by PCI-SIG



04/20/2021
Industry’s first DisplayPort 2.0 Link Layer Compliance Test Solution



04/20/2021
Teledyne LeCroy launches the next generation of High Definition Oscilloscopes



04/20/2021
MAUI® Studio Pro Simplifies and Accelerates Remote Measurements, Analysis and Collaboration



02/23/2021
Teledyne LeCroy Announces Industry-First Capability to Analyze PCI Express® Across Physical and Protocol Layers



02/16/2021
Industry’s First MIPI M-PHY® GEAR 5 UFS 4.0 Protocol Analyzer and Exerciser



01/19/2021
Industry’s First Fibre Channel 64Gbps Fabric Exerciser™